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Composites

 
 

Composite phenolic resins go into a variety of industrial applications. Among them, the primary markets are Rail, Construction, Defense, and Aerospace.

Composite phenolic resins come as resoles, novalac, and catalysts.

Durite™ Resole Resins

Bakelite Phenolic Resoles are Liquid resin, cured in a single step by exposure to heat or acids.

Resin System Description Application
Durite™ SC-1008 Phenolic laminating varnish specifically designed for applications where extended exposure at temperatures up to 500 degrees F is required. MIL-R-9299C (Grade B) and MIL-DTL-64154 (Appendix B)
Durite SC-1008HS™ High solids bersion of the SC-1008. The higher solids and lower VOC ay provide some advantages. Used in aircraft interiors and in high service temperature applications.
Durite™ SL-575B Modified resin to provide toughness and flexibility of the cured matrix. Cured with an acid or latent acid at ambient or relativerly low temperatures. Ths product may be used in filament winding, resin transfer molding or hand lay-up applications.
Durite™ SL-433 Phenol-formaldehyde resole used in laminating applications. Laminating applications.

Durite™ Novalac Resins

Bakelite Phenolic Novalac are powder or flake resin.

Resin System Description Application
Durite™ D_SD-1708 High purity phenol-formaldehyde novolac. Designed to increase the cross-link density of epoxy resins.
Durite™ D_SD-1708 High purity phenol-formaldehyde novolac. Designed to increase the cross-link density of epoxy resins.
Durite™ SD-1713 Phenol-formaldehyde novolac resin that contains high percent of bisphenol-F. Low melting and high molecular weight, designed to provide solvent free/high % solid formulations, and to increase cross-link density of epoxy resins. High temperature applications.
Durite™ SD-1731 High purity phenol-formaldehyde novolac. Low molecular weight designed to increase cross-link density of epoxy resins
Durite™ SD-5143 Pulverized, novolac phenolic resin containing hexamine Used in molding compounds but also in other general bonding applications.
Durite™ SD-5144 Pulverized, novolac phenolic resin containing hexamine

Cellobond™ Resole Resins

Cellobond™ Resole Resins have been designed to have low viscosity specifically to facilitate the manufacture of composites by automated processes such as VARI or Vacuum Infussion where a high degreee of fire safety, excellent mechanical properties or resistance to high temperatures is required.

Cellobond™ Resin and Catalyst combonation processes include, but are not limited to, Hand Laminations, Spray Depositiation, Warm Press Molding, Resin Transfer Molding, Pultrusion (catalyst cute), Vacuum Injection, Resin Infusion, Continuous Lamination, Syntactic Foam.

Resin System Viscosity at 25°C[cP] Variance
Cellobond™ J20207L 180-270 Low viscosity, unmodified liquid phenolic.
Cellobond™ J20207X 150-220 Low viscosity,low free formaldehyde,unmodified liquid phenolic.
Cellobond™ J20207X-01 180-270 Reach compliance. Low viscosity,low free formaldehyde,unmodified liquid phenolic.
Cellobond™ J20/1235L 1000-3000 High temperature applications. High degree of fire safety and excellent mechanical properties.

Cellobond™ Catalyst

Cellobond™ Catalyst systems offer three options. The choice of catalyst depends upon the processing charactersistics required.

Resin System Pot Life at 23 °C Description
Cellobond™ Phencat10 6 - 20 min General purpose, processes such as contact molding (hand lay-up).
Cellobond™ Phencat15 1 - 4 min Fast action, resin injection and spray applications.
Cellobond™ Phencat382 25 min - 8 hrs Delayed action catalyst that is activated at low temperatures, tipically 60-80 °C [g/ml], offering up to a fourfold increase in pot life and reduced exotherm risk in isothermal RTM or press processes.